Research Areas

Ceramics & Metals

Researchers employ computations from the atomistic level to the continuum scale in connection with the experiments aimed at gaining a mechanistic understanding of processing-structure-properties and relationships for these important materials.

  • Physical and mechanical metallurgy

  • Metal deformation and recrystallization

  • Grain boundary structure

  • Thin film and IC interconnect structure/properties relationships

  • Nano and micro fabrication/manufacturing, and materials synthesis/processing

  • Mechanical behavior of materials, Nano/micro-mechanics, fatigue and fracture

Electronic Materials

Many materials can be classified as electronic materials, including conductive, insulating and semi-conductive metals, ceramics, and polymers. Thin films are highly engineered to tight specifications for micro-electronic applications. Researchers analyze microelectronics packaging and the structure and performance of lead-free solders for interconnecting devices. IITTP is also investigating chip-level interconnect manufacturing to avoid electromigration failures. 

  • Near-interface effects in multi-component materials, with emphasis on materials for microelectronics

  • Thin film and IC interconnect structure/properties relationships

  • Electronic transport

Solid Mechanics

How do solid materials deform and fail?  Structural metallic alloys, high-temperature ceramics, polymers, composites, and carbon nanotubes are all characterized by a specific microstructure and specific deformation and failure mechanism. In manufacturing and service industries, these components are subjected to loads, heat, and chemically aggressive environments. The first challenge of solid mechanics is understanding microstructures and deformation/failure mechanisms operating over different length and time scales, from understanding atoms to the wing of an airplane.  

After gaining a qualitative understanding of deformation and failure, the next challenge is dealing in the area of predictive models for manufacturing and service arises. Mathematical formulations give rise to computational models that are then used to simulate deformation and failure processes on different scales with variable resolution. The overall goal is to design new materials and new manufacturing processes and to improve the performance of existing components.

  • Plasticity of crystals and interfaces

  • Micromechanics of granular materials

  • Mechanics: Multiscale modeling, numerical analysis, plasticity, composites, materials instabilities, damage and fracture

  • Dynamic response of materials and structures (experimental characterization, modeling, and simulation)

  • Thermo-mechanics